Micron to Build a $100 Billion Chip ‘Megafab’ in New York

Micron Technology announced plans to build the largest semiconductor facility in the history of the United States, and it will be located in Onondaga County, New York.

This is no small project, with Micron expecting the megafab to require $100 billion of investment(Opens in a new window) and take more than 20 years to complete construction. Over that period, the new facility will create nearly 50,000 New York jobs and 9,000 high-paying positions at Micron. Once completed, Micron expects to have access to four 600,000 square foot cleanrooms (2.4 million square feet of cleanroom space), which is approximately the same size as 40 US football fields.

The company wants 40% of its global DRAM production to be located in the US, and this long-term project is key to achieving that goal.

“This historic leading-edge memory megafab in Central New York will deliver benefits beyond the semiconductor industry by strengthening U.S. technology leadership as well as economic and national security, driving American innovation and competitiveness for decades to come,” said Micron President and CEO Sanjay Mehrotra.

Site preparation in Clay, New York will commence in 2023, construction begins in 2024, and production is expected to start gradually “in the latter half of the decade.” The first phase will see Micron invest $20 billion, and the project is supported by $5.5 billion in incentives from the state of New York over the lifetime of the project. Micron also anticipates receiving federal grants and tax credits from the CHIPS and Science Act, which the company views as “critical to support hiring and capital investment.”

The megafab announcement follows Micron’s $15 billion commitment to build a memory fab in Boise, Idaho announced last month, which forms part of the company’s previous commitment to invest $40 billion in US-based manufacturing.